Via-In-Pad PCB, Conductive (Silver or Copper) Fill or
Non-Conductive Epoxy Fill
Number of Layer:   2 íV 16 Layers (1.60mm thickness)
Solder Mask:   Taiyo PSR4000, Probimer 77, Sunchemical Imagecure íV Series
Peelable Mask:   Peters2955
Surface Finish:   Lead Free HAL, Tin-Lead HAL, Immersion Gold, Immersion Silver, Immersion Tin, Hard Gold, Flash Gold, OSP, Carbon Keypad, Gold Finger Plating.