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| Technology: |
- HDI Microvias: Stacked Vias, Blind and Buried Vias
- Hard Gold Plating
- Via-In-Pad, Conductive
and Non-Conductive via fill
- Mixed Dielectric
Multilayer PCB
- Differential Impedance
- Press Fit Holes
- Heavy Copper
- Ultra Thin Core
- Ultra Fine Line
- Rigid-Flex
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| Advanced
Material: |
- Isola: PCL-370HR, IS400, IS415
- Shengyi: S1000, S1000-2
- ITEQ: IT180A, IT150TC
- Kingboard: KB6164F, KB6167F
- Rogers: RO4003C, RO4350B, RO4533
- Arlon: ML92, 33N(Polyimide) and AD Series
- Taconic: RF-35, TLC
- Nelco: N4000, N8000 Series
- Bergquist: MP-06503
- Halogen Free, High Tg/ Low
CTE, LDP, RCC
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| Manufacturing
Standard: |
- IPC-A-600H Class II & III
- IPC-6012C
- PERFAG 2E for Double-sided
Board
- PERFAG 3C for Multilayer
Board
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