Technology:
  • HDI Microvias: Stacked Vias, Blind and Buried Vias
  • Hard Gold Plating
  • Via-In-Pad, Conductive and Non-Conductive via fill
  • Mixed Dielectric Multilayer PCB
  • Differential Impedance
  • Press Fit Holes
  • Heavy Copper
  • Ultra Thin Core
  • Ultra Fine Line
  • Rigid-Flex
 
 Advanced Material:
  • Isola: PCL-370HR, IS400, IS415
  • Shengyi: S1000, S1000-2
  • ITEQ: IT180A, IT150TC
  • Kingboard: KB6164F, KB6167F
  • Rogers: RO4003C, RO4350B, RO4533
  • Arlon: ML92, 33N(Polyimide) and AD Series
  • Taconic: RF-35, TLC
  • Nelco: N4000, N8000 Series
  • Bergquist: MP-06503
  • Halogen Free, High Tg/ Low CTE, LDP, RCC
 Manufacturing Standard:
  • IPC-A-600H Class II & III
  • IPC-6012C
  • PERFAG 2E for Double-sided Board
  • PERFAG 3C for Multilayer Board